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DOST – MECO-TECO Sandwich Scholarship Program (SSP) 2024 for Philippine Students in Taiwan

MECO-TECO Sandwich Scholarship Program (SSP) 2024. Embark on a scholarly journey with the Department of Science and Technology (DOST) and the National Science and Technology Council (NSTC) of Taiwan. This dynamic collaboration unveils the golden opportunity for Filipino MS/PhD students aspiring to delve into groundbreaking research. Welcome to the Call for Applications for the MECO-TECO Sandwich Scholarship Program (SSP) for the Academic Year 2024.

DISCLAIMER: The articles in this site are for informational purposes only, we are not affiliated to the entities featured, on every post source/registration link are provided at the bottom of every article so that you can Double-Check the AUTHENTICITY and the AVAILABILITY of the Scholarship via those source. The availability may varies.

Exploring MECO-TECO Sandwich Scholarship Program in Taiwan

Are you a Filipino MS/PhD student with a passion for research? MECO-TECO Sandwich Scholarship Program beckons you to immerse yourself in the academic richness of Taiwanese universities and research institutions. Seize the chance to elevate your studies in a vibrant international setting.

Scholarship Perks That Elevate Your Journey

Unleash the potential of your academic pursuits with the enticing benefits offered by the MECO-TECO SSP:

  • Monthly Stipend: NT$20,000 for MS, NT$30,000 for PhD
  • Relocation Assistance: Php30,000 to facilitate your move
  • Roundtrip Economy Airfare: Ensuring a smooth journey
  • Health and Accident Insurance: Your well-being is our priority

ALSO READ: President Jaime Hernandez Scholarship (PJHS) 2024 at University of Nueva Caceres

Submission Deadline

Ensure your aspirations take flight by submitting your applications to the specified office on or before March 15, 2024. Remember, the Sandwich Program is set to commence in September 2024. For ASTHRDP and ERDT scholars, align the SSP duration with your approved scholarship period, and ensure proper endorsement by the respective project leaders.

Application Requirements:

To embark on this transformative journey, ensure you fulfill the necessary requirements. Prepare a comprehensive application package that includes:

  1. Accomplished MECO-TECO SSP Application Form: The Application Form Attached for your convenience
  2. Acceptance Letter from Proposed Host Institution and Adviser: A crucial step in the process
  3. CV of Filipino and Taiwanese Host Professors: Highlighting the expertise guiding your research
  4. Certified Copy of Transcript of Records: Showcasing your academic achievements
  5. Endorsement from Two (2) Former Professors: Demonstrating your academic standing
  6. Endorsement from Project Leader (for ASTHRDP/ERDT Scholars): Critical for ongoing scholarship holders
  7. Recommendation from President of the Agency (if employed): Acknowledging your professional commitment
  8. Two (2) Recent 2×2 ID Pictures: Adding a personal touch to your application

How to Reach Us

For additional information and clarifications, feel free to reach out to the International Technology Cooperation Unit (ITCU). You can visit them at the 3rd Floor, DOST Main Building, DOST Compound, General Santos Avenue, Bicutan, Taguig City. Alternatively, send your inquiries via email to [email protected] or [email protected].

FAQ

1. What is the MECO-TECO Sandwich Scholarship Program (SSP)?

  • The MECO-TECO Sandwich Scholarship Program is a collaborative scholarship initiative between the Department of Science and Technology (DOST) and the National Science and Technology Council (NSTC) of Taiwan. It provides Filipino MS/PhD students the opportunity to conduct research in Taiwanese universities or research institutions.

2. Who is eligible to apply for the scholarship?

  • Filipino MS/PhD students interested in pursuing research in Taiwan are eligible to apply.

3. What are the benefits of the scholarship?

  • The scholarship offers a monthly stipend, relocation assistance, roundtrip economy airfare, and health and accident insurance.

4. What documents are required for the application?

  • Applicants need to submit an accomplished MECO-TECO Sandwich Scholarship Program Application form, an acceptance letter from the proposed host institution and adviser, CVs of Filipino and Taiwanese host professors, certified copies of transcripts, endorsements from former professors or project leaders, and recent 2×2 ID pictures.

5. How can I get more information or clarify doubts?

  • For additional information, you can contact the International Technology Cooperation Unit (ITCU) at the DOST Main Building in Taguig City or reach out via email at [email protected] or [email protected].

6. When is the submission deadline for applications?

  • All applications must be submitted to the specified office on or before March 15, 2024. The Sandwich Program is scheduled to start in September 2024.

7. Is there a specific duration for ASTHRDP and ERDT scholars?

  • Yes, for ASTHRDP and ERDT scholars, the SSP duration should align with the approved duration of their existing scholarships. Endorsements from respective project leaders are necessary.

8. How can I ensure my application is successful?

  • To increase your chances of success, carefully fulfill all application requirements, and ensure timely submission before the deadline.

9. Can I apply if I am currently employed?

  • Yes, employed individuals can apply and should include a recommendation from the president of their agency.

10. What is the contact information for the application office?

  • For inquiries, you can visit the ITCU at the 3rd Floor, DOST Main Building, DOST Compound, General Santos Avenue, Bicutan, Taguig City, or contact them through email at [email protected] or [email protected].

DOST – MECO-TECO Sandwich Scholarship Program (SSP)

Don’t miss this chance to amplify your academic journey and contribute to the global landscape of research. Embrace the MECO-TECO Sandwich Scholarship Program, where knowledge knows no bounds.

DOST - MECO-TECO Sandwich Scholarship Program (SSP)

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